Texas Instruments plans $60 billion U.S. investment

Texas Instruments plans $60 billion U.S. investment

The Texas Instruments headquarters in Dallas, Texas, US, on Sunday, Jan. 21, 2024.

N. Johnson | Bloomberg | Getty Images

Texas Instruments said it would spend more than $60 billion to expand its U.S. manufacturing footprint, the latest chipmaker to ramp up domestic production amid pressure from the Trump administration to reshore the semiconductor supply chain.

The funds will be used to build or expand seven chip-making facilities in Texas as well as Utah, and will create 60,000 jobs, TI said on Wednesday, calling it the “largest investment in foundational semiconductor manufacturing in U.S. history.”

The company did not give a timeline for the investment.

Unlike AI chip firms Nvidia and AMD, TI makes analog or foundational chips used in everyday devices such as smartphones, cars and medical devices, giving it a large client base that includes Apple, SpaceX and Ford Motor.

The spending pledge follows similar announcements from others in the semiconductor industry, including Micron, which said last week that it would expand its U.S. investment by $30 billion, taking its planned spending to $200 billion.

Analysts have said they see the spending commitments as overtures to U.S. President Donald Trump, who has repeatedly threatened to kill the $52.7 billion 2022 CHIPS and Science Act and warned of potential new tariffs on semiconductor imports.

Texas Instruments, which won as much as $1.61 billion in CHIPS Act funding last year, already has a large U.S. presence.

It had been building two facilities in Texas and one in Utah as part of efforts to boost in-house manufacturing and stave off rising competition from Chinese analog chipmakers.

Like other companies unveiling such spending commitments, TI’s announcement includes funds already allocated to facilities that are either under construction or ramping up. It will build two additional plants in Sherman, Texas, based on future demand.

“TI is building dependable, low-cost 300 millimeter capacity at scale to deliver the analog and embedded processing chips that are vital for nearly every type of electronic system,” said CEO Haviv Ilan.

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